High-Performance GPU Heatsink with Heat Pipe & Copper Base Efficient Graphics Card Cooling Solution for HP ProLiant DL360 Gen9

This heatsink adopts a copper aluminum composite structure The main body features high quality aluminum alloy fins paired with a pure copper base and pure copper heat pipes Pure copper is used for the heat conduction core to quickly absorb heat due to its excellent thermal conductivity while aluminum alloy is utilized for the main heat dissipation area to achieve lightweight design and durability without compromising cooling performance It adopts an integrated molding welding process ensuring close contact between heat pipes and fins for seamless heat transfer significantly enhancing heat dissipation efficiency and product lifespan Exclusively designed for HP ProLiant DL360 Gen9 servers it supports processors with a TDP of up to 135W The pure copper base directly contacts the CPU core to rapidly absorb heat which is then quickly conducted away by the heat pipes The large area aluminum fins efficiently dissipate heat in conjunction with the servers airflow system This effectively lowers the CPU operating temperature and ensures long term stable operation of the server in high load high density data center environments